TCL Flip 3
Device specification profile

TCL Flip 3

Complete hardware specifications, launch details and a structured technical breakdown from the TechMyte device database.

Released 2024
143.5g, 19.8mm thickness
KaiOS 3.1
16GB storage, microSDXC
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Sources and limitations

Specification source: GSMArena device record.

Listed specifications are reference information, not results of TechMyte testing. Rumored details may change, and hardware or supported features can differ by region. Confirm the exact model with its manufacturer before buying.

Battery capacity does not establish tested endurance; megapixel count does not establish camera quality. Use the comparison tool to identify differences, then check the features that matter to your use.

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Technical data sheet

Full Specifications

Network

TechnologyGSM / HSPA / LTE
2G bandsGSM 850 / 900 / 1800 / 1900
3G bandsHSDPA 850 / 1700(AWS) / 1900 / 2100
4G bands2, 4, 5, 12, 13, 41, 41, 66
SpeedHSPA, LTE

Launch

Announced2024
StatusAvailable. Released 2024

Body

Dimensions107.2 x 59.4 x 19.8 mm (4.22 x 2.34 x 0.78 in)
Weight143.5 g (5.04 oz)
SIMNano-SIM

Battery

Type1850 mAh
Charging5W wired

Display

Size3.2 inches, 31.7 cm2 (~49.8% screen-to-body ratio)
Resolution240 x 320 pixels, 4:3 ratio (~125 ppi density)
TypeTFT LCD

Platform

OSKaiOS 3.1
ChipsetQualcomm QM215 Snapdragon 215 (28 nm)
CPUQuad-core 1.3 GHz Cortex-A53
GPUAdreno 308

Memory

Card slotmicroSDXC (dedicated slot)
Internal16GB 1GB RAM

Sound

Loudspeaker Yes
3.5mm jack Yes

Comms

WLANWi-Fi 802.11 b/g/n
Bluetooth4.2, A2DP
PositioningGPS
NFCNo
RadioFM radio
USBUSB Type-C

Features

SensorsBarometer

Misc

ColorsBlack
PriceAbout 80 EUR
ModelsT435D
SAR1.36 W/kg (head) 0.94 W/kg (body)

Main Camera

FeaturesLED flash
Video480p@30fps
Single5 MP

Our Tests

Loudspeaker-25.1 LUFS (Very good)