Micromax Q55 Bling
Device specification profile

Micromax Q55 Bling

Complete hardware specifications, launch details and a structured technical breakdown from the TechMyte device database.

Released 2010, February
75g, 16.3mm thickness
Feature phone
10MB storage, microSDHC slot
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Sources and limitations

Specification source: GSMArena device record.

Listed specifications are reference information, not results of TechMyte testing. Rumored details may change, and hardware or supported features can differ by region. Confirm the exact model with its manufacturer before buying.

Battery capacity does not establish tested endurance; megapixel count does not establish camera quality. Use the comparison tool to identify differences, then check the features that matter to your use.

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Technical data sheet

Full Specifications

Network

TechnologyGSM
2G bandsGSM 900 / 1800 - SIM 1
GPRSClass 10
EDGEClass 10

Launch

Announced2010, February. Released 2010, February
StatusDiscontinued

Body

Dimensions70 x 70 x 16.3 mm (2.76 x 2.76 x 0.64 in)
Weight75 g (2.65 oz)
SIMDual SIM (Mini-SIM)
KeyboardQWERTY

Battery

TypeTFT, 256K colors
Talk timeUp to 3 h
Stand-byUp to 180 h

Display

Size2.4 inches, 17.8 cm2 (~36.4% screen-to-body ratio)
Resolution320 x 240 pixels, 4:3 ratio (~167 ppi density)

Memory

Card slotmicroSDHC (dedicated slot)
Internal10MB
Phonebook1000 entries, Photocall
Call recordsYes

Selfie camera

Single2 MP
VideoYes

Sound

Loudspeaker Yes
3.5mm jack No

Comms

WLANNo
BluetoothYes
PositioningNo
RadioStereo FM radio
USBProprietary

Features

Sensors—
BrowserWAP 2.0/xHTML (Opera Mini)
MessagingSMS, MMS
GamesDownloadable
JavaYes, MIDP 2.0

Misc

ColorsWhite
PriceAbout 40 EUR