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alcatel Go Flip 3
Device specification profile

alcatel Go Flip 3

Complete hardware specifications, launch details and a structured technical breakdown from the TechMyte device database.

Released 2019, September 19
118g, 20.1mm thickness
KaiOS 2.5.2
4GB 512MB RAM storage, microSDHC slot
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Sources and limitations

Specification source: GSMArena device record.

Listed specifications are reference information, not results of TechMyte testing. Rumored details may change, and hardware or supported features can differ by region. Confirm the exact model with its manufacturer before buying.

Battery capacity does not establish tested endurance; megapixel count does not establish camera quality. Use the comparison tool to identify differences, then check the features that matter to your use.

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Technical data sheet

Full Specifications

Network

TechnologyGSM / CDMA / HSPA / LTE
2G bandsGSM 850 / 900 / 1800 / 1900
3G bandsHSDPA 850 / 1700(AWS) / 1900
4G bands2, 4, 5, 12, 25, 26, 41, 66, 71
SpeedHSPA, LTE

Launch

Announced2019, September 19
StatusAvailable. Released 2019, September 19

Body

Dimensions104.9 x 53.1 x 20.1 mm (4.13 x 2.09 x 0.79 in)
Weight118 g (4.16 oz)
SIMNano-SIM

Battery

TypeTN TFT LCD

Display

Size2.8 inches, 24.3 cm2 (~43.6% screen-to-body ratio)
Resolution240 x 320 pixels, 4:3 ratio (~143 ppi density)

Platform

OSKaiOS 2.5.2
ChipsetQualcomm MSM8909 Snapdragon 210 (28 nm)
CPUQuad-core 1.1 GHz Cortex-A7
GPUAdreno 304

Memory

Card slotmicroSDHC (dedicated slot)
Internal4GB 512MB RAM

Selfie camera

Single2 MP
Video720p@30fps

Sound

Loudspeaker Yes
3.5mm jack Yes

Comms

WLANWi-Fi 802.11 b/g/n, hotspot
Bluetooth4.2, A2DP
PositioningNo
NFCNo
RadioFM radio
USBmicroUSB 2.0

Features

Sensors—

Misc

ColorsPrime Black
PriceAbout 80 EUR
SAR1.28 W/kg (head)     1.16 W/kg (body)